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TELECOM
components are multi-disciplinary devices that
require exquisitely controlled and manufacturable processes
on all levels. Unlike the silicon industry where considerable
standardization exists, compound semiconductor manufacturing
and packaging techniques span a wide spectrum and success
often depends on the details of these processes. With
this philosophy, Santur has gathered
world-class expertise in these fields and is in the process
of completing an equally high caliber manufacturing facility.
A completely configured clean room with MOCVD capability,
advanced lithography, and thin film tools is used to fabricate
state-of-the-art components, while a custom packaging
lab is tooled to carry out the low cost automated packaging
process. Complementing the manufacturing facility are
advanced design and modeling tools to shorten product
development time.
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